Novel interconnection processes for low cost PEN/PET substrates.
| Autor: | van den Brand, J., Kusters, R., Fledderus, H., Rubingh, E., Podprocky, T., Dietzel, A. |
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| Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-9, 9p |
| Databáze: | Complementary Index |
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