Large panel, highly flexible multilayer thin film boards.
Autor: | Burkard, H., Kapischke, W., Link, J. |
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Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-6, 6p |
Databáze: | Complementary Index |
Externí odkaz: |
Autor: | Burkard, H., Kapischke, W., Link, J. |
---|---|
Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-6, 6p |
Databáze: | Complementary Index |
Externí odkaz: |