Joint project for mechanical qualification of next generation high density package-on-package (PoP) with through mold via technology.
| Autor: | Dreiza, M., Jin Seong Kim, Smith, L. |
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| Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-8, 8p |
| Databáze: | Complementary Index |
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