Encapsulation of the next generation advanced mems& sensor microsystems.
| Autor: | Bos, A., Lingen Wang, van Weelden, T. |
|---|---|
| Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-5, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Bos, A., Lingen Wang, van Weelden, T. |
|---|---|
| Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-5, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|