Wafer post-processing for a reconfigurable wafer-scale circuit board.
Autor: | Radji, M., Lakhssassi, A., Bougataya, M., Hamoui, A., Izquierdo, R. |
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Zdroj: | 2009 European Microelectronics & Packaging Conference; 2009, p1-8, 8p |
Databáze: | Complementary Index |
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