Wafer post-processing for a reconfigurable wafer-scale circuit board.

Autor: Radji, M., Lakhssassi, A., Bougataya, M., Hamoui, A., Izquierdo, R.
Zdroj: 2009 European Microelectronics & Packaging Conference; 2009, p1-8, 8p
Databáze: Complementary Index