Electrical characterization of fine-pitch compliant bumps.
| Autor: | Lin, C.K., Chih Chen, Shyh-Ming Chang, Chao-Chyun An, Hsiao Ting Lee, Kuo-Shu Kao, Jimmy Tsang, Sheng-Shu Yang |
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| Zdroj: | 2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p395-400, 6p |
| Databáze: | Complementary Index |
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