The effect of die-level stress variations on device performance.
| Autor: | Owen, D.M., Otten, C., Haowen Bu, Yun Wang, Shetty, S., Hebb, J. |
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| Zdroj: | 2009 17th International Conference on Advanced Thermal Processing of Semiconductors; 2009, p1-8, 8p |
| Databáze: | Complementary Index |
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