Bumping technologies of fine-pitch BGA components.
| Autor: | Ba?torfi, R., Szo?ke, P., Ola?h, Z., Ge?czy, A., Ruszinko?, M., Illyefalvi-Vite?z, Z. |
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| Zdroj: | 2010 33rd International Spring Seminar on Electronics Technology (ISSE); 2010, p107-112, 6p |
| Databáze: | Complementary Index |
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