Integration of carrierless ultrathin wafers into a TSV process flow.
| Autor: | Bieck, F., Spiller, S., Molina, F., To?pper, M., Lopper, C., Kuna, I., Fischer, T., Roder, J., Dietrich, L., Tabuchi, T. |
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| Zdroj: | 2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p571-575, 5p |
| Databáze: | Complementary Index |
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