Head-in-pillow defect - role of the solder ball alloy.

Autor:	Pandher, R., Jodhan, N., Raut, R., Liberatore, M.
Zdroj:	2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p151-156, 6p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu