Fine pitch low temperature rdl damascene process development for TSV integration.
| Autor: | Li, H. Y., Pang, X. F., Ong, L. G., Li, H. B., Lee, W. S., Khan, Navas, Teo, K. H., Gao, S. |
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| Zdroj: | 2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p52-55, 4p |
| Databáze: | Complementary Index |
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