Low cost Thin Film packaging for MEMS over molded.
| Autor: | Pornin, J.-L., Gillot, C., Billard, C., Lagoutte, E., Pellat, M., Parat, G., Sillon, N. |
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| Zdroj: | Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-4, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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