Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications.
| Autor: | SeungJae Lee, SangWon Kim, GaWon Kim, KiCheol Bae, JiHeon Yu, JinYoung Kim, HeeYeoul Yoo, ChoonHeung Lee |
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| Zdroj: | Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-6, 6p |
| Databáze: | Complementary Index |
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