Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects.
| Autor: | Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B. |
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| Zdroj: | Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-4, 4p |
| Databáze: | Complementary Index |
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