Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill.
| Autor: | Xingrui Chen, Teng Wang, Nurnus, J., Benkendorf, M., Liu, J. |
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| Zdroj: | 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p1250-1254, 5p |
| Databáze: | Complementary Index |
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