Multi-Gbit I/O and interconnect co-design for power efficient links.

Autor: Jaussi, J.E., Leddige, M., Horine, B., O'Mahony, F., Casper, B.
Zdroj: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging & Systems (EPEPS); 2010, p1-4, 4p
Databáze: Complementary Index