Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards.
| Autor: | Plotog, I., Varzaru, G., Bunea, R., Busu, I., Cucu, T., Svasta, P. |
|---|---|
| Zdroj: | 2010 IEEE 16th International Symposium for Design & Technology in Electronic Packaging (SIITME); 2010, p287-290, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|