Nonlinear dynamic behavior of thin PCB board for solder joint reliability study under shock loading.
| Autor: | Loh Wei Keat, Lee Yung Hsiang, Ajay Munigayah, Tay Tiong We |
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| Zdroj: | 2005 International Symposium on Electronics Materials & Packaging; 2005, p268-274, 7p |
| Databáze: | Complementary Index |
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