Effect of mild aging on package drop performance for lead free solders.
| Autor: | SeokHo Na, SeWoong Cha, WonJoon Kang, TaeSeong Kim, TaeKyung Hwang, JinYoung Khim |
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| Zdroj: | 2010 IEEE CPMT Symposium Japan; 2010, p1-5, 5p |
| Databáze: | Complementary Index |
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