Copper interconnect microanalysis and electromigration reliability performance due to the impact of TLP ESD.
| Autor: | Sherry, Suat Cheng Khoo, Tan, P-Y, Chua, E-C, Tan Carol, S-C, Manna, I., Redkar, S., Ansari, S. |
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| Zdroj: | 2002 Electrical Overstress/Electrostatic Discharge Symposium; 2002, p385-389, 5p |
| Databáze: | Complementary Index |
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