Reduction of defects caused by chemical mechanical polishing of oxide surfaces and contamination of the wafer bevel.
| Autor: | Gallus, S.M., Niedermeier, F., Maue, M. |
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| Zdroj: | 2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference; 2009, p1-4, 4p |
| Databáze: | Complementary Index |
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