Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging.
| Autor: | Wunderle, B., Auersperg, J., Grosser, V., Kaulfersch, E., Wittler, O., Michel, B. |
|---|---|
| Zdroj: | Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS 2003; 2003, p335-340, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|