Low cost, high thermal conductivity composite heat spreaders for power electronics.

Autor: Kowbel, W., Champion, W., Withers, J.C., Shih, W.
Zdroj: Sixteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.00CH37068); 2000, p195-200, 6p
Databáze: Complementary Index