Low cost, high thermal conductivity composite heat spreaders for power electronics.
Autor: | Kowbel, W., Champion, W., Withers, J.C., Shih, W. |
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Zdroj: | Sixteenth Annual IEEE Semiconductor Thermal Measurement & Management Symposium (Cat. No.00CH37068); 2000, p195-200, 6p |
Databáze: | Complementary Index |
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