Chemical dry cleaning technology for reliable 65 nm CMOS contact to NiSix.
| Autor: | Honda, M., Tsutsumi, K., Harakawa, H., Nomachi, A., Murakami, K., Ooya, K., Kudou, T., Nagamatsu, T., Ezawa, H. |
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| Zdroj: | Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005; 2005, p194-196, 3p |
| Databáze: | Complementary Index |
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