The enabling solution of Cu/low-k planarization technology.
| Autor: | Wada, Y., Noji, I., Kobata, I., Kohama, T., Fukunaga, A., Tsujimura, M. |
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| Zdroj: | Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005; 2005, p126-128, 3p |
| Databáze: | Complementary Index |
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