Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics.
| Autor: | Hoofman, R.J.O.M., Michelon, J., Bancken, P.H.L., Daamen, R., Verheijden, G.J.A.M., Arnal, V., Hinsinger, O., Gosset, L.G., Humbert, A., Besling, W.F.A., Goldberg, C., Fox, R., Michaelson, L., Guedj, C., Guillaumond, J.F., Jousseaume, V., Arnaud, L., Gravesteijn, D.J., Torres, J., Passemard, G. |
|---|---|
| Zdroj: | Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005; 2005, p85-87, 3p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|