Microstructure evolution of electroplated Cu during room temperature transient.
| Autor: | Gribelyuk, M.A., Malhotra, S.G., Locke, P.S., DeHaven, P., Fluegel, J., Parks, C., Simon, A.H., Murphy, R. |
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| Zdroj: | Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p188-190, 3p |
| Databáze: | Complementary Index |
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