Reliability of copper dual damascene influenced by pre-clean.
| Autor: | Tokei, Zs., Lanckmans, F., Van den bosch, G., Van Hove, M., Maex, K., Bender, H., Hens, S., Van Landuyt, J. |
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| Zdroj: | Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits (Cat. No.02TH8614); 2002, p118-123, 6p |
| Databáze: | Complementary Index |
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