Design of a high reliability and low thermal resistance interface material for microelectronics.
| Autor: | Gowda, A., Zhong, A., Esler, D., David, J., Sandeep, T., Srihari, K., Schattenmann, F. |
|---|---|
| Zdroj: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003); 2003, p557-562, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|