3D stackable packages with bumpless interconnect technology.
| Autor: | Lin, C.W.C., Chiang, S.C.L., Yang, T.K.A. |
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| Zdroj: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003); 2003, p8-12, 5p |
| Databáze: | Complementary Index |
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