Electrical characterization of model-based dummy feature insertion in Cu interconnects.
| Autor: | Doong, K.Y.Y., Lin, K.-C., Tseng, T.-C., Lu, Y.C., Lin, S.C., Hung, L.J., Ho, P.S., Hsieh, S., Young, K.L., Liang, M.S. |
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| Zdroj: | Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516); 2004, p87-92, 6p |
| Databáze: | Complementary Index |
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