A sub-surface metallization post-process IC module for RF technology.
| Autor: | Ng, K.T., Pham, N.P., Rejaei, B., Sarro, P.M., Burghartz, J.N. |
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| Zdroj: | Proceedings of the 2000 BIPOLAR/BiCMOS Circuits & Technology Meeting (Cat. No.00CH37124); 2000, p195-198, 4p |
| Databáze: | Complementary Index |
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