130 nm process technology integration of advanced Cu/CVD low k dielectric material-case study of failure analysis and yield enhancement.
| Autor: | Tsang, C.F., Su, Y.J., Bliznetsov, V.N., Ang, G.T. |
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| Zdroj: | Proceedings of the 10th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2003); 2003, p63-68, 6p |
| Databáze: | Complementary Index |
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