Critical issues in post Cu CMP cleaning.
| Autor: | Fyen, W., Vos, R., Teerlinck, I., Lagrange, S., Lauerhaas, J., Meuris, M., Mertens, P., Heyns, M. |
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| Zdroj: | Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130); 2000, p415-418, 4p |
| Databáze: | Complementary Index |
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