Thermal-mechanical analysis of Terabus high-speed optoelectronic package.
| Autor: | Shashikant Hegde, Lei Shan, Kuchta, D.M., Kwark, Y.H., Baks, C.W., Doany, F., Kash, J.A., Trewhella, J.M. |
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| Zdroj: | Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p1854-1854, 1p |
| Databáze: | Complementary Index |
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