A Vertical Wafer Level Packaging using Through Hole Filled Via Interconnects by Lift Off Polymer Method for MEMS and 3D Stacking Applications.
| Autor: | Premachandran, C.S., Mohanraj, R.N.S., Chong Ser Choong, Iyer, M.K. |
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| Zdroj: | Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p1094-1098, 5p |
| Databáze: | Complementary Index |
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