Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages.
| Autor: | Xuejun Fan, Raiser, G., Vasudevan, V.S. |
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| Zdroj: | Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p901-906, 6p |
| Databáze: | Complementary Index |
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