An Applicatin of Micro-Ball Wafer Bumping to Double Ball Bump for Flip Chip Interconnection.
| Autor: | Tatsumi, K., Yamamoto, Y., Iwata, K., Hashino, E., Ishikawa, S., Kohno, T., Miyajima, F., Nakazawa, H. |
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| Zdroj: | Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p855-860, 6p |
| Databáze: | Complementary Index |
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