150 μm Pitch Pb~Free Flipchip Packaging with Cu/Low~k Interconnects.
| Autor: | Seung Wook Yoon, Kripesh, V., Viswanath, A., Hong Yu Li, Iyer, M.K. |
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| Zdroj: | Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p100-106, 7p |
| Databáze: | Complementary Index |
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