High Surface Planarity Die Bonding of Large Optical Chips.
| Autor: | Kunzelmann, U., Wagner, M., Schenk, H., Lakner, H. |
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| Zdroj: | Polytronic 2005 - 5th International Conference on Polymers & Adhesives in Microelectronics & Photonics; 2005, p117-122, 6p |
| Databáze: | Complementary Index |
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