Extraction of process-induced damage in low-k/Cu damascene structure.
| Autor: | Chikaki, S., Shimoyama, M., Yagi, R., Yoshino, T., Shishida, Y., Ono, T., Ishikawa, A., Fujii, N., Nakayama, T., Kohmura, K., Tanaka, H., Kawahara, J., Matsuo, H., Takada, S., Yamanishi, T., Hishiya, S., Hata, N., Kinoshita, K., Kikkawa, T. |
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| Zdroj: | ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005; 2005, p422-425, 4p |
| Databáze: | Complementary Index |
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