PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement.
| Autor: | Kim, J.-D., Choi, W.-S., Park, K.-S., Kim, E.-H., Lee, S.-B., Kim, H.-G. |
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| Zdroj: | IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585); 2004, p40-44, 5p |
| Databáze: | Complementary Index |
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