Comparison of isothermal wafer-level EM and package-level EM for via test structure in dual damascene low k/Copper process.
| Autor: | Chang, M.N., Chang, K.P., Sue, K.C. |
|---|---|
| Zdroj: | IEEE International Integrated Reliability Workshop Final Report, 2002; 2002, p192-195, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|