Fatigue life of solder bumps in a system in package: relating power cycling to thermal cycling.
| Autor: | Beijer, J.G.J., Jansen, M.Y., Janssen, G.M., Bielen, J.A., Tijssen, E.P.A. |
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| Zdroj: | EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems; 2006, p1-7, 7p |
| Databáze: | Complementary Index |
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