Experimental investigation of the adhesion dilation with negative thermal expansion LiAlSi2O6 fillers.
| Autor: | Tsai, H.-H., Cheng, C.D., Shieh, W.B., Lee, K.T., Feng, H.P. |
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| Zdroj: | EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Micro-Electronics & Micro-Systems, 2005; 2005, p467-470, 4p |
| Databáze: | Complementary Index |
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