Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach.

Autor: Cacchione, F., Corigliano, A., De Masi, B., Ferrera, M.
Zdroj: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Micro-Electronics & Micro-Systems, 2005; 2005, p100-104, 5p
Databáze: Complementary Index