A study about solder bumping process by using the electro-plating method.
| Autor: | Sung-Chang Choi, In-Ho Chi, Jeong-Gi Jin, Kyoung-Soon Bok |
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| Zdroj: | Advances in Electronic Materials & Packaging 2001 (Cat. No.01EX506); 2001, p170-177, 8p |
| Databáze: | Complementary Index |
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