A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology].
| Autor: | Sung-Ki Lee, Jeong-Gi Jin, Young-Ho Kim, Jae-Ho Lee |
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| Zdroj: | Advances in Electronic Materials & Packaging 2001 (Cat. No.01EX506); 2001, p73-78, 6p |
| Databáze: | Complementary Index |
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