Low-cost embedded capacitor technology with hydrothermal and sol-gel processes.
| Autor: | Abothu, I.R., Raj, P.M., Balaraman, D., Sacks, M.D., Bhattacharya, S., Tummala, R.R. |
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| Zdroj: | 2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p78-83, 6p |
| Databáze: | Complementary Index |
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