Packaging of devices for topside cooling by replacing air-bridges with Su-8 polymer bridges [MESFET example].
| Autor: | Wright, J.I., Fillion, R., Meyer, L., Shaddock, D. |
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| Zdroj: | 2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p63-68, 6p |
| Databáze: | Complementary Index |
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